Title :
A CMOS integrated thermal sensor based on Single-Walled Carbon Nanotubes
Author :
Agarwal, Vinay ; Chen, Chia Ling ; Dokmeci, Mehmet R. ; Sonkusale, Sameer
Author_Institution :
Dept. of Electr. & Comput. Eng., Tufts Univ., Medford, MA
Abstract :
This paper presents a fully functional thermal sensor based on Single-Walled Carbon Nanotubes (SWNTs) integrated with CMOS interface circuitry utilizing die-level post-CMOS processing. The SWNTs are incorporated on the CMOS circuitry by utilizing a low temperature Dielectrophoretic (DEP) assembly process, which includes a pretreatment of an electroless zincation to prepare the top metal layer of the CMOS chip for assembly. The entire sensor system is next encapsulated with a parylene-C layer for improving the contacts between the SWNTs and the electrodes. The SWNTs were assembled as the gain element of an integrated inverting amplifier circuit. I-V measurements indicate that the temperature coefficient of resistance for the SWNT-based thermal sensor is -0.40% over a temperature range from 25degC to 105degC. The indirect measurement of the TC from the AC gain of the amplifier displayed a temperature coefficient of -0.33% over the same temperature range. This is the first successful demonstration of a fully functional SWNT-based thermal sensor on CMOS and the entire concept can be easily extended to other nanostructures for numerous other applications.
Keywords :
CMOS integrated circuits; carbon nanotubes; electrophoresis; temperature sensors; thermal variables measurement; CMOS chip; CMOS integrated thermal sensor; CMOS interface; I-V measurements; SWNT-based thermal sensor; die-level post-CMOS processing; electroless zincation; gain element; integrated inverting amplifier circuit; low temperature dielectrophoretic assembly; parylene-C layer; sensor system; single-walled carbon nanotubes; temperature coefficient; temperature range; Assembly; CMOS process; Carbon nanotubes; Dielectrophoresis; Electrical resistance measurement; Integrated circuit measurements; Temperature distribution; Temperature sensors; Thermal resistance; Thermal sensors; CMOS circuitry; CMOS-CNT; Dielectrophoretic assembly; Nanoscale integration; Parylene-C encapsulation; Single-Walled-Carbon-Nanotubes (SWNTs); Thermal Sensor;
Conference_Titel :
Sensors, 2008 IEEE
Conference_Location :
Lecce
Print_ISBN :
978-1-4244-2580-8
Electronic_ISBN :
1930-0395
DOI :
10.1109/ICSENS.2008.4716549