Title :
Computer assisted design study of a low-cost pressure sensor
Author :
Meuwissen, M.H.H. ; Veninga, B.P. ; Tijdink, M.W.W.J. ; Meijerink, M.G.H.
Author_Institution :
TNO Sci. & Ind., Eindhoven, Netherlands
Abstract :
The application of numerical techniques for the design of a low cost pressure sensor is described. The numerical techniques assist in addressing issues related to the thermo-mechanical performance of the sensor. This comprises the selection of the materials and dimensions used for the sensor itself and the substrate on which it is mounted. Moreover, simulations are applied to aid in the selection of suitable solder interconnect materials and dimensions. Where possible, the accuracy of the numerical predictions is assessed by comparing them to experiments on physical prototypes. The application of numerical simulations allowed for a reduction in the number of physical tests and thereby a reduction in design time and costs.
Keywords :
ceramic packaging; cost optimal control; microsensors; numerical analysis; pressure sensors; reliability; solders; surface mount technology; thermal management (packaging); computer assisted design; pressure sensor; solder interconnect; thermomechanical performance; Acoustic sensors; Biomembranes; Costs; Dielectric substrates; Mechanical sensors; Prototypes; Silicon; Temperature sensors; Thermal sensors; Thermomechanical processes;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502860