Title :
Low temperature studies of SIMOX charge trapping
Author_Institution :
US Naval Res. Lab., Washington, DC, USA
Abstract :
The charge trapping of the buried layer is studied by irradiating SIMOX (separation by implanted oxygen) capacitors at cryogenic temperatures and comparing the result to thermal oxide control samples. The thermal and SIMOX oxide thicknesses are 4000 Å and 3700 Å, respectively. The buildup of positive charge during an X-ray irradiation at 60 K with the gates grounded is shown. Data are shown for doses ranging from 7 to 870 krad(SiO2). Over this range, both oxides have similar net positive charge buildup. In addition, the results of isochronal annealing are shown for a thermal oxide capacitor and two SIMOX capacitors from the same wafer. The effects of field stressing after irradiation but while still at 60 K are also shown. Above 30 V (about 0.8 MV/cm), there is a large increase in the net positive charge that continues to increase to at least 90 V
Keywords :
X-ray effects; annealing; cryogenics; electron traps; hole traps; semiconductor-insulator boundaries; 3700 AA; 4000 AA; 60 K; 7*103 to 870*103 rad; Si-SiO2; X-ray irradiation; buried layer; capacitors; cryogenic temperatures; field stressing; isochronal annealing; low temperature study; oxide thicknesses; positive charge buildup; thermal oxide control samples; Aluminum; Annealing; Capacitance-voltage characteristics; Capacitors; Cryogenics; Laboratories; Silicon; Temperature control; Temperature measurement; Voltage;
Conference_Titel :
SOI Conference, 1991. Proceedings, 1991., IEEE International
Conference_Location :
Vail Valley, CO
Print_ISBN :
0-7803-0184-6
DOI :
10.1109/SOI.1991.162878