• DocumentCode
    189750
  • Title

    CMOS 0.18 µm standard process capacitive MEMS high-Q oscillator with ultra low-power TIA readout system

  • Author

    Kuo, F.Y. ; Chang, C.F. ; Wen, K.A.

  • Author_Institution
    Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2014
  • fDate
    2-5 Nov. 2014
  • Firstpage
    911
  • Lastpage
    914
  • Abstract
    This paper presents the first monolithic ultra-low power MEMS oscillator that can be manufactured in the ASIC compatible standard CMOS process and monolithically integrated with TIA circuitry. It is designed for high Q value and moderate motional impedance under strict design constraints of the standard fabrication process. A high gain ultra-low power sustaining TIA amplifier circuit is compactly integrated with the resonator structure on a single die for low-power 32 kHz clock generation. The proposed 1.69μW MEMS oscillator can be embedded in common SoC applications monolithically to provide clock sources.
  • Keywords
    CMOS analogue integrated circuits; application specific integrated circuits; integrated circuit design; low-power electronics; microfabrication; micromechanical resonators; operational amplifiers; radiofrequency amplifiers; radiofrequency integrated circuits; radiofrequency oscillators; readout electronics; ASIC; SoC application; capacitive MEMS high-Q oscillator; frequency 32 kHz; high gain ultra-low power sustaining TIA amplifier circuit; low-power clock generation; monolithic ultralow power MEMS oscillator; motional impedance; power 1.69 muW; resonator structure; size 0.18 mum; standard CMOS process; standard fabrication process; transimpedance amplifier; ultralow-power TIA readout system; Bandwidth; CMOS integrated circuits; Clocks; Micromechanical devices; Oscillators; Standards; System-on-chip; CMOS MEMS; SoC; real time clock; silicon resonator; trans-impedance amplifier;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2014 IEEE
  • Conference_Location
    Valencia
  • Type

    conf

  • DOI
    10.1109/ICSENS.2014.6985149
  • Filename
    6985149