Silicones with improved thermal conductivity for thermal management in electronic packaging

The design, use, and application of thermal compounds in popular electronic packages are described. Typical properties of silicones are addressed, including the differences between thermally conductive silicone greases, gels, and adhesives. Recent trends in electronic-packaging thermal-management techniques are also covered. Specific attention is given to multi-chip modules utilizing thermal compounds for heat removal through the top of the flip chip. The key properties of highly thermally conductive materials are highlighted. These areas include the selection of filler type, filler packing, and total filler loading. The properties of a thermal compound developed for flip-chip application are explained in detail, and attention is given to how the above areas have been optimized in this product. It is concluded that the proper selection and use of thermally conductive silicones, as presently described, can greatly enhance the performance of many electronic packages