Title :
Silicones with improved thermal conductivity for thermal management in electronic packaging
Author :
Peterson, Adam L.
Author_Institution :
Dow Corning Corp., Midland, MI, USA
Abstract :
The design, use, and application of thermal compounds in popular electronic packages are described. Typical properties of silicones are addressed, including the differences between thermally conductive silicone greases, gels, and adhesives. Recent trends in electronic-packaging thermal-management techniques are also covered. Specific attention is given to multi-chip modules utilizing thermal compounds for heat removal through the top of the flip chip. The key properties of highly thermally conductive materials are highlighted. These areas include the selection of filler type, filler packing, and total filler loading. The properties of a thermal compound developed for flip-chip application are explained in detail, and attention is given to how the above areas have been optimized in this product. It is concluded that the proper selection and use of thermally conductive silicones, as presently described, can greatly enhance the performance of many electronic packages
Keywords :
cooling; flip-chip devices; modules; packaging; silicones; adhesives; electronic packages; electronic packaging; electronic-packaging thermal-management techniques; filler packing; flip chip; gels; heat removal; multi-chip modules; silicone greases; thermal conductivity; thermal management; total filler loading; Conducting materials; Electronic packaging thermal management; Electronics packaging; Heat sinks; Resistance heating; Temperature; Thermal conductivity; Thermal management; Thermal management of electronics; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122251
