Title :
Performance improvement of resonant inductive coupling for wireless 3D IC interconnect
Author :
Han, Sangwook ; Wentzloff, David D.
Author_Institution :
EECS Dept., Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
In this paper, we propose using resonant inductive-coupling for wireless interconnect between 3D ICs. First, a comparison of resonant inductive coupling (RIC) and standard inductive coupling (SIC) is discussed. Analytical models for signal coupling are derived for SIC and RIC links as they apply to 3D wireless interconnect, and verified through HFSS simulations using a 130 nm CMOS process. Finally, a performance comparison between the two methods is presented.
Keywords :
integrated circuit interconnections; three-dimensional integrated circuits; CMOS process; HFSS simulations; resonant inductive coupling; signal coupling; size 130 nm; wireless 3D IC interconnect; Coils; Couplings; Integrated circuit modeling; Silicon carbide; Three dimensional displays; Transmitters; Wireless communication;
Conference_Titel :
Antennas and Propagation Society International Symposium (APSURSI), 2010 IEEE
Conference_Location :
Toronto, ON
Print_ISBN :
978-1-4244-4967-5
DOI :
10.1109/APS.2010.5562078
