DocumentCode
1897663
Title
Performance improvement of resonant inductive coupling for wireless 3D IC interconnect
Author
Han, Sangwook ; Wentzloff, David D.
Author_Institution
EECS Dept., Univ. of Michigan, Ann Arbor, MI, USA
fYear
2010
fDate
11-17 July 2010
Firstpage
1
Lastpage
4
Abstract
In this paper, we propose using resonant inductive-coupling for wireless interconnect between 3D ICs. First, a comparison of resonant inductive coupling (RIC) and standard inductive coupling (SIC) is discussed. Analytical models for signal coupling are derived for SIC and RIC links as they apply to 3D wireless interconnect, and verified through HFSS simulations using a 130 nm CMOS process. Finally, a performance comparison between the two methods is presented.
Keywords
integrated circuit interconnections; three-dimensional integrated circuits; CMOS process; HFSS simulations; resonant inductive coupling; signal coupling; size 130 nm; wireless 3D IC interconnect; Coils; Couplings; Integrated circuit modeling; Silicon carbide; Three dimensional displays; Transmitters; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium (APSURSI), 2010 IEEE
Conference_Location
Toronto, ON
ISSN
1522-3965
Print_ISBN
978-1-4244-4967-5
Type
conf
DOI
10.1109/APS.2010.5562078
Filename
5562078
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