Title :
New spin cleaner with megasonic for single wafer processing based on UCT cleaning concept
Author :
Okano, Shouichi ; Kawada, Kazuhiko ; Nakamori, Mitsunori ; Nitta, Takahisa ; Ohmi, Tadahiro
Author_Institution :
Dept. of Electron. Eng., Tohoku Univ., Sendai, Japan
Abstract :
In compliance with pattern density increase of Si substrates, Ultra clean of more large surface of materials are required, and single wafer processing are catching manufacturer´s attention. For this cleaning equipment, new type spin cleaner by using high frequency ultrasonic cleaner unit (we call Megasonic squall), is developed which generates solvent flow curtain having 1.6 MHz ultrasonic energy. Process of development, structure and cleaning technical characters are described
Keywords :
elemental semiconductors; nozzles; semiconductor technology; silicon; ultrasonic cleaning; 1.6 MHz; Si; Si substrates; UCT cleaning; high frequency ultrasonic cleaner; megasonic squall; pattern density; single wafer processing; solvent flow curtain; spin cleaner; ultrasonic energy; Chemicals; Educational institutions; Frequency; Manufacturing processes; Size control; Solvents; Stability; Surface cleaning; Temperature; Testing;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3752-2
DOI :
10.1109/ISSM.1997.664554
