New spin cleaner with megasonic for single wafer processing based on UCT cleaning concept

Author

Okano, Shouichi ; Kawada, Kazuhiko ; Nakamori, Mitsunori ; Nitta, Takahisa ; Ohmi, Tadahiro

Author_Institution

Dept. of Electron. Eng., Tohoku Univ., Sendai, Japan

fYear

1997

fDate

6-8 Oct 1997

Lastpage

12

Abstract

In compliance with pattern density increase of Si substrates, Ultra clean of more large surface of materials are required, and single wafer processing are catching manufacturer´s attention. For this cleaning equipment, new type spin cleaner by using high frequency ultrasonic cleaner unit (we call Megasonic squall), is developed which generates solvent flow curtain having 1.6 MHz ultrasonic energy. Process of development, structure and cleaning technical characters are described

Keywords

elemental semiconductors; nozzles; semiconductor technology; silicon; ultrasonic cleaning; 1.6 MHz; Si; Si substrates; UCT cleaning; high frequency ultrasonic cleaner; megasonic squall; pattern density; single wafer processing; solvent flow curtain; spin cleaner; ultrasonic energy; Chemicals; Educational institutions; Frequency; Manufacturing processes; Size control; Solvents; Stability; Surface cleaning; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-3752-2

Type

conf

DOI

10.1109/ISSM.1997.664554

Filename

664554