DocumentCode
1897747
Title
Chapter 21, Compnent level thermal analysis
fYear
2005
fDate
18-20 April 2005
Firstpage
661
Lastpage
661
Keywords
Assembly; Finite element methods; GSM; Helium; Lead; Microelectronics; Performance analysis; Soldering; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502884
Filename
1502884
Link To Document