Title :
Chapter 21, Compnent level thermal analysis
Keywords :
Assembly; Finite element methods; GSM; Helium; Lead; Microelectronics; Performance analysis; Soldering; Temperature;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502884
