DocumentCode
1897799
Title
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
Author
Steenberge, Nele Van ; Vandevelde, Bart ; Schildermans, Inge ; Willems, Geert
Author_Institution
IMEC, Leuven, Belgium
fYear
2005
fDate
18-20 April 2005
Firstpage
675
Lastpage
680
Abstract
The development of a simplified analytical model to describe the thermal history of a printed circuit board assembly (PCA) during convective reflow soldering is described in this paper. Verification of the assumptions was done by finite element modeling, as well as comparison with experimental measured temperature profiles.
Keywords
finite element analysis; printed circuit manufacture; reflow soldering; thermal management (packaging); PCA; analytical model; convective reflow soldering; electronic assembly; finite element model; lead-free soldering; printed circuit board assembly; thermal behavior; Analytical models; Assembly; Environmentally friendly manufacturing techniques; Finite element methods; History; Lead; Printed circuits; Semiconductor device modeling; Soldering; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502887
Filename
1502887
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