• DocumentCode
    189793
  • Title

    An ultra high-Q micromechanical in-plane tuning fork

  • Author

    Xiaobo Guo ; Mehdizadeh, Emad ; Kumar, Varun ; Ramezany, Alireza ; Pourkamali, Siavash

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
  • fYear
    2014
  • fDate
    2-5 Nov. 2014
  • Firstpage
    990
  • Lastpage
    993
  • Abstract
    This work presents a micromechanical in-plane tuning fork with internal vibration amplification ability that can be used as an ultra-sensitive MEMS gyroscope. The structure is designed to incorporate a thermal-piezoresistive energy pump for one of the vibration modes leading to significant amplification of vibration amplitude with the same actuation force. Up to 473X vibration amplitude enhancement has been demonstrated leading to a measured effective quality factor (Q) of 10.4×106 for the vibration mode with intrinsic mechanical Q of 22,097. This was achieved by applying a bias current of only 1.607mA to the piezoresistor embedded within the structure. The internal thermal-piezoresistive amplification is caused by coupling of mechanical strain and Joule´s heating in the piezoresistor biased with a DC current. Measured effective Q values as a function of bias current agree with the theoretical predication. Theoretically there is no upper limit on the achievable effective Q provided that the bias current can be controlled with adequate precision.
  • Keywords
    Q-factor; gyroscopes; microsensors; piezoresistive devices; vibrational modes; DC current biased piezoresistor; Joule heating; internal thermal-piezoresistive amplification; internal vibration amplification; mechanical strain; quality factor; thermal-piezoresistive energy pump; ultrahigh-Q micromechanical in-plane tuning fork; ultrasensitive MEMS gyroscope; vibration modes; Couplings; Current measurement; Force; Gyroscopes; Q measurement; Vibrations; Voltage measurement; MEMS; Q-enhancement; energy pump; gyroscope; thermal piezoresistive; tuning fork; ultra high-Q;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2014 IEEE
  • Conference_Location
    Valencia
  • Type

    conf

  • DOI
    10.1109/ICSENS.2014.6985169
  • Filename
    6985169