Title :
Extending the limits of air-cooling in microelectronic equipment
Author :
Rodgers, Peter ; Eveloy, Valérie ; Pecht, Michael G.
Author_Institution :
CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
Abstract :
Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed, including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.
Keywords :
heat sinks; integrated circuits; nanotechnology; thermal management (packaging); thermal resistance; air-cooling; fan performance; heat sink analysis; heat sink design; heat sink surface fouling; heat spreading; hybrid thermal management; interface thermal resistance minimization; microelectronic equipment; Educational institutions; Electronics cooling; Heat sinks; Heat transfer; Microelectronics; Resistance heating; Surface resistance; Thermal management; Thermal management of electronics; Thermal resistance;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502891
