• DocumentCode
    1899069
  • Title

    A silicon compiler approach to the design of SOI ASIC´s

  • Author

    Bartholet, B. ; White, M. ; Priebe, G.W. ; Kopman, M. ; McGehee, D. ; Griffin, M.

  • Author_Institution
    Boeing Corp., Seattle, WA, USA
  • fYear
    1991
  • fDate
    1-3 Oct 1991
  • Firstpage
    170
  • Lastpage
    171
  • Abstract
    A highly integrated, radiation hardened silicon compiler (RHSC) capable of totally automating the rad hard ASIC (application-specific integrated circuit) design process is described. The RHSC is built on two proven technologies, the Cascade ChipCrafter design tools and the Honeywell SOI (silicon-on-insulator) process. SOI provides the foundation to utilize extensive existing module generator software while meeting radiation hardness requirements. In addition, SOI offers a significant density and performance advantage compared to bulk. The design tools automatically perform power analysis and routing, electromigration analysis and routing, and clock skew minimization. With the high level of integration offered by the RHSC, no knowledge of integrated circuit design or radiation hardened electronics is required for SOI ASIC product development
  • Keywords
    CMOS integrated circuits; VLSI; application specific integrated circuits; circuit layout CAD; radiation hardening (electronics); semiconductor-insulator boundaries; CMOS; Cascade ChipCrafter design tools; RHSC; SOI ASIC product development; clock skew minimization; electromigration analysis; integrated circuit design; module generator software; power analysis; proven technologies; rad hard ASIC; radiation hardened electronics; radiation hardened silicon compiler; radiation hardness; routing; silicon compiler approach; Application specific integrated circuits; Clocks; Electromigration; Integrated circuit technology; Performance analysis; Process design; Radiation hardening; Routing; Silicon compiler; Silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1991. Proceedings, 1991., IEEE International
  • Conference_Location
    Vail Valley, CO
  • Print_ISBN
    0-7803-0184-6
  • Type

    conf

  • DOI
    10.1109/SOI.1991.162911
  • Filename
    162911