Title :
Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)
Abstract :
The conference program begins with an address on the subject of Ambient Intelligence. This concept refers to the presence of a digital environment that is sensitive, adaptive and responsive to the presence of people. Subsequent presentation sessions address critical issues for ULSI circuits, low k dielectrics, advanced barrier materials and processes, interconnect system performance and reliability, copper/low k integration, and chemical mechanical planarization. Added features this year are new sessions on advanced packaging and optical interconnect that will introduce alternative solutions to the scaling problems facing conventional wiring technology.
Keywords :
integrated circuit interconnections; ULSI circuit; ambient intelligence; chemical-mechanical planarization; copper/low-k integration; diffusion barrier; interconnect technology; low-k dielectric; optical interconnect; packaging; reliability; Integrated circuit interconnections;
Conference_Titel :
Interconnect Technology Conference, 2002. Proceedings of the IEEE 2002 International
Conference_Location :
Burlingame, CA, USA
Print_ISBN :
0-7803-7216-6
DOI :
10.1109/IITC.2002.1014867
