Title :
Transient measurement method for the thermal properties of the thin-film membrane in a multi-parameter wind sensor
Author :
Beigelbeck, R. ; Cerimovic, S. ; Kohl, F. ; Voglhuber, T. ; Jakoby, B. ; Reyes-Romero, D. ; Urban, G.
Author_Institution :
Center for Integrated Sensor Syst., Danube Univ. Krems, Wiener Neustadt, Austria
Abstract :
The performance of our previously devised thermal multi-parameter wind sensor for gaseous fluids is noticeably influenced by the thermal heat shunt induced by the thin-film membrane where heating and temperature sensing elements are embedded. Consequently, reliable values for the thermal parameters of the thin-film membrane are mandatory for their design and characterization. We present a new method to determine the thermal conductivity, thermal diffusivity, and average spectral emissivity of the thin-film membrane. Compared to commonly used measurement techniques for these thermal thin-film parameters, our method does not require custom-built specimens, i. e., the results can be obtained from transient excess temperature measurements carried out directly on the wind sensor device. We describe the theoretical background of this method, provide an efficient analytical model for the data evaluation including its validation by computer numerical analyses, and showcase sample measurements on multi-layer SixNy-SiO2 thin films.
Keywords :
emissivity; silicon compounds; temperature measurement; temperature sensors; thermal conductivity measurement; thermal diffusivity; thin film sensors; SixNy-SiO2; average spectral emissivity; computer numerical analyses; data evaluation; efficient analytical model; gaseous fluids; heating sensing elements; temperature sensing elements; thermal conductivity measurement; thermal diffusivity measurement; thermal heat shunt; thermal multiparameter wind sensor; thermal thin film parameters; thin film membrane; transient excess temperature measurement; transient measurement method; Conductivity; Heat transfer; Heating; Temperature measurement; Thermal sensors; Thermistors;
Conference_Titel :
SENSORS, 2014 IEEE
Conference_Location :
Valencia
DOI :
10.1109/ICSENS.2014.6985250