Title :
A Bipolar 144 kbit/s ISDN Line Interface using Pulse Density Modulation
Author_Institution :
STC Technology Ltd.
Keywords :
Chip scale packaging; Copper; Digital signal processing chips; Echo cancellers; ISDN; Joining processes; Pulse modulation; Pulse transformers; Signal processing; Wire;
Conference_Titel :
Solid-state Circuits Conference, 1987. ESSCIRC '87. 13th European
Conference_Location :
Taunus-Tagungs-Zentrum, F.R. Germany