• DocumentCode
    189949
  • Title

    A hybrid CSVM-HMM model for acoustic signal classification using a tetrahedral sensor array

  • Author

    Hao Wu ; Gurram, Prudhvi ; Heesung Kwon ; Prasad, Saurabh

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Houston, Houston, TX, USA
  • fYear
    2014
  • fDate
    2-5 Nov. 2014
  • Firstpage
    1352
  • Lastpage
    1355
  • Abstract
    In this paper, we propose a new framework for classification of multi-channel acoustic signals collected with a tetrahedral sensor array from the events of launch and impact of two different weapon types. While the temporal dynamics of transient acoustic signals can be well represented by Hidden Markov Models (HMMs), HMM is not an effective discriminative model. On the other hand, discriminative models such as Support Vector Machines (SVMs) are not able to capture the useful dynamic information and cannot handle variable length features obtained from temporal signals. Thus, in this work, we integrate SVMs and an HMM-based representation model to improve the classification of the four events. Moreover, Contextual SVMs (CSVMs) are employed in this system in order to capture the higher-order correlations among the multiple channels of the acoustic signal, and also handle the situations, where one or more of the four sensors fail. Experimental results indicate that the proposed model results in significant improvement in classification accuracy of the multi-channel acoustic signals compared to a traditional HMM framework and SVM classifier.
  • Keywords
    acoustic signal processing; hidden Markov models; sensor arrays; signal classification; support vector machines; SVM classifier; acoustic signal classification; contextual SVMs; hidden Markov models; hybrid CSVM-HMM model; multichannel acoustic signals; support vector machines; tetrahedral sensor array; Accuracy; Acoustics; Arrays; Hidden Markov models; Probability; Support vector machines; Training;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2014 IEEE
  • Conference_Location
    Valencia
  • Type

    conf

  • DOI
    10.1109/ICSENS.2014.6985262
  • Filename
    6985262