DocumentCode :
190001
Title :
Comparison of polypropylene and FR4 dielectric cavity for RLSA antenna design at 5.8GHz
Author :
Ibrahim, I.M. ; Rahman, T.A. ; Sabran, M.I. ; Jamlos, M.F.
Author_Institution :
Fac. of Electron. & Comput. Eng., Univ. Teknikal Malaysia, Melaka, Malaysia
fYear :
2014
fDate :
14-16 April 2014
Firstpage :
232
Lastpage :
234
Abstract :
The Radial Line Slot Array (RLSA) Antenna is very pleasing due to low profile appearance and high gain characteristic. Recent research on RLSA is to produce a light weight, durable and easy fabrication process. Thus, FR4 is an alternative substrate to replace the polypropylene. This paper presents a comparison of polypropylene and FR4 dielectric substrate for linear polarized Radial Line Slot Array (RLSA) antenna at 5.8 GHz frequency. Both antennas implemented the same radiating slot design in an antenna with diameter of 200mm. The results show an improvement of radiation pattern using FR4 dielectric substrate as compare to polypropylene dielectric base. However, the reflection coefficient for polypropylene substrate show specific resonant at 5.8GHz frequency while FR4 substrate introduce multiple resonant. This paper also suggested FR4 board can be a potential substrate and major component for RLSA antenna development in future.
Keywords :
antenna radiation patterns; microwave antennas; slot antenna arrays; FR4 board; FR4 dielectric cavity; FR4 dielectric substrate; FR4 substrate; RLSA antenna; RLSA antenna design; RLSA antenna development; fabrication process; frequency 5.8 GHz; linear polarized radial line slot array; polypropylene comparison; polypropylene dielectric base; polypropylene substrate; profile appearance; radial line slot array; radiating slot design; radiation pattern; reflection coefficient; size 200 mm; Antenna radiation patterns; Arrays; Cavity resonators; Dielectrics; Slot antennas; Substrates; FR4 substrate; RLSA antenna; polypropylene substrate; slot antenna;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Region 10 Symposium, 2014 IEEE
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4799-2028-0
Type :
conf
DOI :
10.1109/TENCONSpring.2014.6863032
Filename :
6863032
Link To Document :
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