Title :
Sea of leads microwave characterization and process integration with FEOL and BEOL
Author :
Bakir, Muhannad S. ; Thacker, Hiren D. ; Zhou, Zhiping ; Kohl, Paul A. ; Martin, Kevin P. ; Meindl, James D.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Complete front-end-of-the-line (FEOL), back-end-of-the-line (BEOL), and Sea of Leads (SoL) process integration is reported with the end result being fully packaged CMOS dice at wafer-level. In addition, SoL microwave characterization in the 0.1-45 GHz frequency range demonstrates that the insertion-loss decreases with increasing lead thickness and decreasing lead length. Worst case insertion-loss for signal path into- and out- of the package was measured at wafer-level to be 1.15 dB at 45 GHz. Crosstalk between parallel leads was approximately -30 dB at 45 GHz. Finally, the fabrication of a high-density substrate for SoL using low cost multi-crystalline Si is reported.
Keywords :
CMOS integrated circuits; MMIC; crosstalk; integrated circuit measurement; integrated circuit packaging; microwave measurement; 0.1 to 45 GHz; 1.15 dB; BEOL; FEOL; SoL characterization; SoL package; back-end-of-the-line; front-end-of-the-line; high-density substrate fabrication; insertion-loss; low cost multi-crystalline Si; microwave characterization; packaged CMOS dice; process integration; sea of leads packaging technology; sea of leads process; CMOS process; CMOS technology; Fabrication; Frequency; Neck; Packaging; Plasma applications; Polymers; Sea measurements; Wafer scale integration;
Conference_Titel :
Interconnect Technology Conference, 2002. Proceedings of the IEEE 2002 International
Print_ISBN :
0-7803-7216-6
DOI :
10.1109/IITC.2002.1014906
