• DocumentCode
    190042
  • Title

    Remoldable inductors based on self-heating fusible alloys

  • Author

    Lazarus, Nathan ; Bedair, Sarah S. ; Meyer, Christopher

  • Author_Institution
    Oak Ridge Assoc. Univ. Fellowship Program, US Army Research Laboratory, Adelphi, MD, USA
  • fYear
    2014
  • fDate
    2-5 Nov. 2014
  • Firstpage
    1551
  • Lastpage
    1554
  • Abstract
    Wirelessly powering sensor systems attached to a curved or non-planar surface requires inductor coils able to conform to an irregular geometry. In this work, a coil is demonstrated based on pulling a low melting point (fusible) metal alloy in liquid form through fluidic channels in soft silicone. Although solid at room temperature, when inductors made of Field´s metal are heated through Joule heating above the melting point (62°C) of the alloy, the traces melt, allowing deformation to conform to a surface. The heating power can then be removed, causing the alloy to solidify and hold the new shape. This recasting is demonstrated by creating a mechanically tunable inductor. The coil is stretched to tune the inductance while liquid, with solidification used as a latching mechanism to hold the inductance with zero static power. During tuning, an applied power of 0.8 W is used to melt the inductor traces. Tuning of 50%, from 96 nH to 147 nH, is demonstrated with a fusible alloy inductor; when the inductor was again re-heated, the inductance returned to the initial value due to the restoring mechanical force of the surrounding silicone.
  • Keywords
    alloys; flexible electronics; inductance; inductors; solidification; flexible electronics; inductance; latching mechanism; low melting point metal alloy; mechanical force; power 0.8 W; remoldable inductors; self-heating fusible alloys; solidification; Coils; Heating; Inductance; Inductors; Liquids; Metals; Testing; Tunable inductors; flexible electronics; fusible alloys; microsolidics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2014 IEEE
  • Conference_Location
    Valencia
  • Type

    conf

  • DOI
    10.1109/ICSENS.2014.6985312
  • Filename
    6985312