Title :
Resonance frequency sensing for acoustic material shattering system
Author :
Yuen Chark See ; Lew Kim Luong ; Xuan Teng Cheng ; Iek Kang Lau
Author_Institution :
Fac. of Eng. & Sci., Univ. Tunku Abdul Rahman, Kuala Lumpur, Malaysia
Abstract :
Resonance is a powerful phenomenon that makes a material to vibrate vigorously; it is possible to shatter the material if the applied power is greater than the power that the material is able to withstand. In this case, resonance wave can be an effective approach to replace the classical approach which uses explosion to shatter the selected material. Hence, an acoustic shattering system is designed to shatter the glassy material in a non-contacting way. In this project, a power amplifier is designed to fulfil the power required by the speaker that produces a concentrated acoustic wave. In order to measure the performance of the system, an automated testing program is designed to evaluate the system and the test results are logged for display and future reference. The transmitter is calibrated to minimize the error and to achieve a flat frequency response. Parameters such as distance between the transmitter and sample material, wave intensity, wave concentration and wave frequency are determined to improve the performance of the system. The designed program will obtain the natural frequency after going through series of sine sweep automatically. Then, acoustic wave at natural frequency of the material will be transmitted to shatter the material. The system is implemented on a FPGA platform. The proposed system able to shatter glassy material like wine glasses automatically.
Keywords :
acoustic intensity measurement; acoustic resonance; acoustic wave transmission; frequency response; microphones; power amplifiers; FPGA platform; acoustic material shattering system; acoustic wave; frequency response; power amplifier; resonance frequency sensing; resonance wave; sine sweep; transmitter; wave concentration; wave frequency; wave intensity; Acoustic waves; Frequency measurement; Frequency response; Materials; Microphones; Resonant frequency; Vibrations; NI myDAQ; microphone; resonance frequency; speaker;
Conference_Titel :
Region 10 Symposium, 2014 IEEE
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4799-2028-0
DOI :
10.1109/TENCONSpring.2014.6863081