• DocumentCode
    190159
  • Title

    Improved pressure response with embedded solid microbeads in microfluidic soft sensors

  • Author

    Hee-Sup Shin ; Yong-Lae Park

  • Author_Institution
    Mech. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    2014
  • fDate
    2-5 Nov. 2014
  • Firstpage
    1788
  • Lastpage
    1791
  • Abstract
    Soft sensors with embedded microchannels filled with liquid conductors have recently been proposed for detecting various types of mechanical stimuli, such as contact pressures, shear forces, strains, and curvatures. Their sensing behaviors are mainly determined by geometrical changes of the embedded microchannels, which is caused by mechanical deformation of the soft structures. In order to control the cross-sectional changes of the microchannels for desired sensor responses, we propose to add solid non-conductive microbeads in the microchannels. Using finite element analysis, we evaluated the influence of the embedded microbeads on the pressure response of soft sensors. We also experimentally compared the pressure responses of soft sensors with rectangular microchannels by changing the number of the beads. Our preliminary results from simulation and experiments showed that the embedded microbeads improved the pressure response of the soft sensors in terms of their linearity, sensitivity, and dynamic range.
  • Keywords
    finite element analysis; microfluidics; microsensors; pressure sensors; contact pressures; curvatures; embedded microchannel; embedded solid microbeads; finite element analysis; liquid conductor; mechanical deformation; microfluidic soft sensors; pressure response; shear forces; solid nonconductive microbeads addition; strains; Conductors; Liquids; Mechanical sensors; Microchannels; Sensitivity; Solids;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2014 IEEE
  • Conference_Location
    Valencia
  • Type

    conf

  • DOI
    10.1109/ICSENS.2014.6985372
  • Filename
    6985372