Title :
Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003
Abstract :
The following topics were dealt: Failure analysis I; reliability and failure analysis in specialist devices; failure analysis II; advanced interconnects I; failure analysis III; packaging related failure mechanisms; advanced interconnects; dielectrics and hot carrier reliability I; dielectrics and hot carrier reliability II; EOS/ESD and CMOS latchup; failure analysis IV; failure analysis V.
Keywords :
CMOS integrated circuits; circuit reliability; dielectric materials; electrostatic discharge; failure analysis; hot carriers; integrated circuits; interconnections; CMOS latchup; EOS/ESD; dielectrics; failure analysis; hot carrier reliability; integrated circuits; interconnects; reliability; CMOS integrated circuits; Circuit reliability; Dielectric materials; Electrostatic discharges; Failure analysis; Hot carriers; Integrated circuits;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
0-7803-7722-2
DOI :
10.1109/IPFA.2003.1222709
