• DocumentCode
    1901709
  • Title

    Power dissipation issues in interconnect performance optimization for sub-180 nm designs

  • Author

    Banerjee, K. ; Mehrotra, A.

  • Author_Institution
    Center for Integrated Syst., Stanford Univ., CA, USA
  • fYear
    2002
  • fDate
    13-15 June 2002
  • Firstpage
    12
  • Lastpage
    15
  • Abstract
    This paper addresses the problem of power dissipation during the buffer insertion phase of interconnect performance optimization. It is shown that the interconnect delay is actually very shallow with respect to both the repeater size and separation close to the minimum point. A methodology is developed to calculate the repeater size and inter-buffer interconnect length which minimizes the total interconnect power dissipation for any given delay penalty. This methodology is used to calculate the power-optimal buffering schemes for various ITRS technology nodes for 5% delay penalty. Furthermore, this technique is also used to quantify the relative importance of the various components of the power dissipation for power-optimal solutions for various technology nodes.
  • Keywords
    VLSI; circuit optimisation; delays; integrated circuit interconnections; integrated circuit layout; low-power electronics; 180 nm; ITRS technology nodes; buffer insertion phase; delay penalty; inter-buffer interconnect length; interconnect delay; interconnect performance optimization; power dissipation; power-optimal buffering schemes; repeater size; Capacitance; Delay estimation; Integrated circuit interconnections; Integrated circuit technology; Optimization; Power dissipation; Power system interconnection; Repeaters; Routing; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Circuits Digest of Technical Papers, 2002. Symposium on
  • Conference_Location
    Honolulu, HI, USA
  • Print_ISBN
    0-7803-7310-3
  • Type

    conf

  • DOI
    10.1109/VLSIC.2002.1015029
  • Filename
    1015029