Benzocyclobutene as a dielectric for multichip module fabrication

Author

Berry, M.J. ; Tessier, T.G. ; Turlik, I. ; Adema, G.M. ; Burdeaux, D.C. ; Carr, J.N. ; Garrou, P.

Author_Institution

MCNC, Research Triangle Park, NC, USA

fYear

1990

fDate

20-23 May 1990

Firstpage

746

Abstract

Data compiled for an experimental nonsilicon-containing benzocyclobutene (BCBII) are presented. The results are compared with those obtained from the standard silicon-containing benzocyclobutene (BCBI). The comparison is based on results obtained from studies of properties such as planarization, stress, adhesion, and pinhole density on both spin and spray coatings of the BCB materials. Planarization studies were performed using a test pattern containing a variety of linewidth and space dimensions. A single-beam laser deflection method was utilized for the measurement of stress. Adhesion properties were determined using a Sebastian III adherence tester. A summary of these results and their implications for the use of BCB as a dielectric material for multichip module (MCM) fabrication is presented

Keywords

adhesion; dielectric thin films; measurement by laser beam; modules; packaging; polymer films; spray coatings; stress measurement; BCB materials; Sebastian III adherence tester; adhesion; benzocyclobutene; linewidth; multichip module fabrication; pinhole density; planarization; single-beam laser deflection method; space dimensions; spin coatings; spray coatings; stress; Adhesives; Coatings; Dielectrics; Fabrication; Multichip modules; Optical materials; Planarization; Spraying; Stress; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1990. ., 40th

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ECTC.1990.122272

Filename

122272