• DocumentCode
    190188
  • Title

    Removal of nonspecific bindings in on-chip ELISAs with low power ultrasound

  • Author

    Brandhoff, Lukas ; Vellekoop, Michael J. ; Redl, Heinz ; Haller, Anna ; Zirath, Helene ; Peham, Johannes ; Wiesinger-Mayr, Herbert ; Spittler, Andreas ; Schnetz, Guntram

  • Author_Institution
    Inst. for Microsensors, -Actuators, & -Syst., (IMSAS/MCB), Univ. of Bremen, Bremen, Germany
  • fYear
    2014
  • fDate
    2-5 Nov. 2014
  • Firstpage
    1862
  • Lastpage
    1865
  • Abstract
    We present a novel method for removing nonspecifically bound proteins for on-chip ELISAs (Enzyme-Linked-Immuno-Sorbent-Assays) by integrated ultrasonic washing of the reaction chamber. Low power ultrasound is concentrated into the reaction chamber with an ultrasonic horn contained in the base of the measurement system. Application of ultrasonication during the last washing step of the ELISA protocol removes adsorbed proteins from the wall while not affecting specifically bound analytes. This method reduces the cost of the disposable assay-chips, while delivering comparable results with standard blocking methods.
  • Keywords
    adsorption; biochemistry; biological techniques; biosensors; bonds (chemical); desorption; enzymes; lab-on-a-chip; molecular biophysics; spectrochemical analysis; surface cleaning; ultrasonic applications; ELISA protocol; disposable assay-chip cost reduction; enzyme-linked-immuno-sorbent-assay; integrated ultrasonic washing; low power ultrasound concentration; measurement system; nonspecific protein binding removal; on-chip ELISA nonspecific binding removal; protein adsorption; reaction chamber; specific analyte binding; standard blocking method; ultrasonic horn; ultrasonication application; Acoustics; Fluorescence; Microfluidics; Proteins; System-on-chip; Ultrasonic imaging; Ultrasonic variables measurement; ELISA; Immunoassay; Lab-On-a-Chip; Sonication; Ultrasonic Horn; Ultrasound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2014 IEEE
  • Conference_Location
    Valencia
  • Type

    conf

  • DOI
    10.1109/ICSENS.2014.6985391
  • Filename
    6985391