Title :
Flip chip silicon fracture mechanism with 3-point bend metrology on flip chip ball grid array
Author :
Chong, Kam Meng ; Lim, Hang Keang ; Ong, Chin Seng
Author_Institution :
Intel Technol., Penang, Malaysia
Abstract :
In this paper, the V-shape silicon cracking was identified due to extreme bending to substrate. The fracture initialise once the stress on silicon exceed the silicon strength.
Keywords :
ball grid arrays; bending; cracks; elemental semiconductors; flip-chip devices; fracture; integrated circuit measurement; integrated circuits; internal stresses; semiconductor devices; silicon; Si; bending; cracking; flip chip ball grid array; flip chip silicon; fracture; stress; Assembly; Electronics packaging; Encapsulation; Equations; Fixtures; Flip chip; Metrology; Silicon; Tensile stress; Thermal stresses;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN :
0-7803-7722-2
DOI :
10.1109/IPFA.2003.1222746
