DocumentCode
1902042
Title
Higher resolution acoustic images using frequency domain imaging
Author
Semmens, J.E. ; Kessler, Lawrence W.
Author_Institution
Sonoscan Inc., Bensenville, IL, USA
fYear
2003
fDate
7-11 July 2003
Firstpage
103
Lastpage
107
Abstract
FFT frequency domain imaging has been used to reveal features down to only Angstroms in thickness, which is substantially below the accepted wavelength limit of the resolution, in applications such as wafer bonding, flip chips, and MEMS.
Keywords
acoustic imaging; fast Fourier transforms; flip-chip devices; frequency-domain analysis; micromechanical devices; wafer bonding; MEMS; acoustic micro imaging; fast Fourier transforms; flip chips; frequency domain imaging; higher resolution acoustic images; wafer bonding; Acoustic applications; Acoustic devices; Acoustic imaging; Acoustic materials; Acoustic pulses; Ambient intelligence; Frequency domain analysis; High-resolution imaging; Image resolution; Ultrasonic imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN
0-7803-7722-2
Type
conf
DOI
10.1109/IPFA.2003.1222747
Filename
1222747
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