Title :
Higher resolution acoustic images using frequency domain imaging
Author :
Semmens, J.E. ; Kessler, Lawrence W.
Author_Institution :
Sonoscan Inc., Bensenville, IL, USA
Abstract :
FFT frequency domain imaging has been used to reveal features down to only Angstroms in thickness, which is substantially below the accepted wavelength limit of the resolution, in applications such as wafer bonding, flip chips, and MEMS.
Keywords :
acoustic imaging; fast Fourier transforms; flip-chip devices; frequency-domain analysis; micromechanical devices; wafer bonding; MEMS; acoustic micro imaging; fast Fourier transforms; flip chips; frequency domain imaging; higher resolution acoustic images; wafer bonding; Acoustic applications; Acoustic devices; Acoustic imaging; Acoustic materials; Acoustic pulses; Ambient intelligence; Frequency domain analysis; High-resolution imaging; Image resolution; Ultrasonic imaging;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN :
0-7803-7722-2
DOI :
10.1109/IPFA.2003.1222747
