DocumentCode
1902079
Title
Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish
Author
Ratchev, P. ; Vandevelde, B. ; Wolf, I. De
Author_Institution
IMEC, Leuven, Belgium
fYear
2003
fDate
7-11 July 2003
Firstpage
113
Lastpage
116
Abstract
The authors study the reliability and failure mechanisms of eutectic SnAgCu solder interconnects on NiAu surface finish. As a comparision, the reliability and failure mechanism of standard SnPb solder joints on SiAu surface finish is studied as well. The similarities and differences in the failure modes for both solders are analysed and discussed.
Keywords
copper alloys; eutectic alloys; failure analysis; gold alloys; integrated circuit interconnections; integrated circuit reliability; nickel alloys; silver alloys; solders; tin alloys; NiAu surface; SnAgCu-NiAu; eutectic SnAgCu solder interconnections; failure analysis; reliability analysis; Bonding; Electronic packaging thermal management; Electrons; Environmentally friendly manufacturing techniques; Failure analysis; Gold; Intermetallic; Lead; Soldering; Surface finishing;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN
0-7803-7722-2
Type
conf
DOI
10.1109/IPFA.2003.1222749
Filename
1222749
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