Title :
Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish
Author :
Ratchev, P. ; Vandevelde, B. ; Wolf, I. De
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
The authors study the reliability and failure mechanisms of eutectic SnAgCu solder interconnects on NiAu surface finish. As a comparision, the reliability and failure mechanism of standard SnPb solder joints on SiAu surface finish is studied as well. The similarities and differences in the failure modes for both solders are analysed and discussed.
Keywords :
copper alloys; eutectic alloys; failure analysis; gold alloys; integrated circuit interconnections; integrated circuit reliability; nickel alloys; silver alloys; solders; tin alloys; NiAu surface; SnAgCu-NiAu; eutectic SnAgCu solder interconnections; failure analysis; reliability analysis; Bonding; Electronic packaging thermal management; Electrons; Environmentally friendly manufacturing techniques; Failure analysis; Gold; Intermetallic; Lead; Soldering; Surface finishing;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN :
0-7803-7722-2
DOI :
10.1109/IPFA.2003.1222749
