DocumentCode
1902124
Title
Real case studies of fast wafer level reliability (FWLR) EM test as process reliability monitor methodology
Author
Yap, A.K.L. ; Ling, T.W.H. ; Yap, H.K. ; Lim, Bee Hoon ; Tan, Yew Chce ; Lo, Keng Foo
Author_Institution
Chartered Semicond. Manuf. Ltd., Singapore, Singapore
fYear
2003
fDate
7-11 July 2003
Firstpage
117
Lastpage
122
Abstract
In this paper, we present real case studies to illustrate SWEAT and ISOT EM tests effectiveness as reliability screens and monitoring methodology.
Keywords
acceleration; aluminium compounds; electromigration; process monitoring; reliability; AlOF; fast wafer level reliability; isothermal electromigration; process reliability monitor; reliability screens; standard wafer level electromigration acceleration test; Computer aided software engineering; Degradation; Electromigration; Feedback; Life estimation; Monitoring; Temperature; Testing; Thermal resistance; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN
0-7803-7722-2
Type
conf
DOI
10.1109/IPFA.2003.1222750
Filename
1222750
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