Title :
Real case studies of fast wafer level reliability (FWLR) EM test as process reliability monitor methodology
Author :
Yap, A.K.L. ; Ling, T.W.H. ; Yap, H.K. ; Lim, Bee Hoon ; Tan, Yew Chce ; Lo, Keng Foo
Author_Institution :
Chartered Semicond. Manuf. Ltd., Singapore, Singapore
Abstract :
In this paper, we present real case studies to illustrate SWEAT and ISOT EM tests effectiveness as reliability screens and monitoring methodology.
Keywords :
acceleration; aluminium compounds; electromigration; process monitoring; reliability; AlOF; fast wafer level reliability; isothermal electromigration; process reliability monitor; reliability screens; standard wafer level electromigration acceleration test; Computer aided software engineering; Degradation; Electromigration; Feedback; Life estimation; Monitoring; Temperature; Testing; Thermal resistance; Thermal stresses;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN :
0-7803-7722-2
DOI :
10.1109/IPFA.2003.1222750
