DocumentCode :
1902210
Title :
Plasma charging damage immunities of rapid thermal nitrided oxide and decoupled plasma nitrided oxide
Author :
Chong, Daniel ; Yoo, Won Jong ; Lek, Chun Meng
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
fYear :
2003
fDate :
7-11 July 2003
Firstpage :
141
Lastpage :
145
Abstract :
Plasma process induced damage on rapid thermal nitrided oxide (RTNO) and decoupled plasma nitrided oxide (DPNO) gate dielectrics are evaluated. It is found that the level of plasma induced damage on DPNO is comparable to that of RTNO. Hence, we can conclude that the decoupled plasma nitridation (DPN) process does not introduce significant damage to the silicon dioxide gate dielectric. We also discovered that RTNO fares better than DPNO in term of plasma charging damage immunity when both gate dielectrics are subjected to simulated plasma charging stresses.
Keywords :
dielectric materials; nitridation; plasma materials processing; rapid thermal processing; silicon compounds; SiO2; decoupled plasma nitrided oxide; gate dielectrics; plasma charging damage immunities; plasma induced damage; rapid thermal nitrided oxide; silicon dioxide gate dielectric; stresses; Dielectrics; Nitrogen; Plasma density; Plasma devices; Plasma materials processing; Plasma properties; Plasma simulation; Plasma temperature; Rapid thermal processing; Silicon compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN :
0-7803-7722-2
Type :
conf
DOI :
10.1109/IPFA.2003.1222754
Filename :
1222754
Link To Document :
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