DocumentCode
190230
Title
Dynamic response of MEMS sensor near fundamental and higher-order frequencies
Author
Ouakad, Hassen M. ; Younis, Mohammad I.
Author_Institution
Mech. Eng. Dept., King Fahd Univ. of Pet. & Miner., Dhahran, Saudi Arabia
fYear
2014
fDate
2-5 Nov. 2014
Firstpage
1956
Lastpage
1959
Abstract
We present a theoretical and experimental investigations into the dynamic response of initially curved microbeams (arches) near their fundamental as well as higher-order frequencies. A reduced-order model based on a nonlinear Euler-Bernoulli beam model is utilized. The model accounts for the electrostatic bias on the microbeam and its geometric nonlinearities (mid-plane stretching and initial curvature). Simulation results are presented showing the combined effect of the nonlinear electrostatic force and the initial curvature in triggering the so-called snap-through instability of the investigated microbeams. For the experimental part, two micromachined initally curved beams made of polysilicon were subjected to DC and AC harmonic loads. Several experimental data are shown demonstrating softening and hardening behaviors of the considered structures near their first and third natural frequencies, respectively, as well as a possible dynamic snap-through motion.
Keywords
dynamic response; electrostatic devices; electrostatics; elemental semiconductors; frequency measurement; micromachining; microsensors; reduced order systems; silicon; AC harmonic load; DC harmonic load; MEMS sensor; Si; dynamic response; electrostatic bias; geometric nonlinearity; higher-order frequency; initially curved microbeam; micromachined initially curved beam; midplane stretching; nonlinear Euler-Bernoulli beam model; nonlinear electrostatic force; polysilicon; reduced-order model; snap-through instability; snap-through motion; Damping; Dynamics; Frequency measurement; Laser beams; Micromechanical devices; Read only memory; Resonant frequency; Dynamic; Fundamental Frequency; Higher-Order Frequency; MEMS; Sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
SENSORS, 2014 IEEE
Conference_Location
Valencia
Type
conf
DOI
10.1109/ICSENS.2014.6985415
Filename
6985415
Link To Document