DocumentCode :
1902328
Title :
Reliability of ultrathin JVD silicon nitride MNSFETs under high field stressing
Author :
ManjulaRani, K.N. ; Rao, V. Ramgopal ; Vasi, J.
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol., Mumbai, India
fYear :
2003
fDate :
7-11 July 2003
Firstpage :
168
Lastpage :
172
Abstract :
In this paper, we study the reliability of n-channel Metal-Nitride-Silicon FETs fabricated using ultrathin Jet Vapor Deposited (JVD) Silicon Nitride gate dielectric under constant voltage stressing. Due to the stress, shifts in threshold voltage and transconductance as well as interface state generation are observed. Our study shows that degradation is polarity dependent. MNSFETs show lower degradation when the applied stress voltage is positive. We have also compared the performance of MNSFETs with conventional MOSFETs under identical stress conditions. Under positive stressing, MNSFETs clearly outperform the MOSFETs but under negative stressing MNSFETs show more degradation.
Keywords :
MISFET; dielectric materials; interface states; semiconductor device reliability; silicon compounds; stress effects; MOSFET; SiN; high field stressing; interface state; polarity; reliability; silicon nitride gate dielectric; threshold voltage; transconductance; ultrathin JVD silicon nitride metal nitride FETs; ultrathin jet vapor deposition; Annealing; Charge pumps; Degradation; Dielectrics; FETs; Interface states; MOSFETs; Silicon; Stress; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN :
0-7803-7722-2
Type :
conf
DOI :
10.1109/IPFA.2003.1222759
Filename :
1222759
Link To Document :
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