DocumentCode
1902451
Title
Localization of electrical failures from the backside of the die: Failure Analysis case studies using infrared emission microscope
Author
Bailon, M.F. ; Tarun, A.B. ; Nery, M. ; Munoz, J.
Author_Institution
Quality & Reliability Dept., Intel Technol. Philippines Inc., Cavite, Philippines
fYear
2003
fDate
7-11 July 2003
Firstpage
193
Lastpage
197
Abstract
We demonstrate how the Infrared Emission Microscope was used to localize defects in standard I/O pins of integrated circuits and how emission images were used to verify electrical fail signatures. The paper also discusses a method that can be used to improve the localization of electrical failures.
Keywords
electrical faults; failure analysis; infrared imaging; integrated circuit technology; optical microscopy; electrical failures; emission images; failure analysis; infrared emission microscopy; integrated circuits; localize defects; Atomic force microscopy; Circuit faults; Computer aided software engineering; Electron emission; Failure analysis; Integrated circuit interconnections; Optical microscopy; Scanning electron microscopy; Transistors; Transmission electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the
Print_ISBN
0-7803-7722-2
Type
conf
DOI
10.1109/IPFA.2003.1222764
Filename
1222764
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