Title :
Optimized cell structure for FinFET array Flash memory
Author :
Cho, E.S. ; Kim, T.Y. ; Lee, C.H. ; Lee, C. ; Yoon, J.M. ; Cho, H.J. ; Kang, H.S. ; Ahn, Y.J. ; Park, Donggun ; Kinam Kim
Author_Institution :
Semicond. R&D Div., Samsung Electron. Co., Kyunggi-Do, South Korea
Abstract :
In this paper, a highly manufacturable 256 M body tied tri-gate fin array NOR-type Flash memory, with 70 nm fin width, was successfully fabricated and the characteristics were compared with planar cell array transistors. In this experiment, a 1.6 times higher driving current of the fin array flash memory cell transistor is achieved than that of a planar device with the same gate length. We propose an optimized fin structure for flash memory operation and a direction for enhanced current of the fin array flash memory cell transistor with respect to the channel silicon plane, coupling ratio, junction profile and anti-punch through implantation conditions.
Keywords :
MOS memory circuits; circuit optimisation; flash memories; 256 Mbit; 70 nm; FinFET array flash memory; NOR-type Flash memory; antipunch through implantation conditions; body tied tri-gate fin array; channel silicon plane; coupling ratio; junction profile; memory cell transistor driving current; optimized flash memory cell structure; Channel hot electron injection; Etching; FinFETs; Flash memory; Flash memory cells; MOSFETs; Oxidation; Pulp manufacturing; Research and development; Transistors;
Conference_Titel :
Solid-State Device Research conference, 2004. ESSDERC 2004. Proceeding of the 34th European
Print_ISBN :
0-7803-8478-4
DOI :
10.1109/ESSDER.2004.1356546