DocumentCode :
190321
Title :
Low-profile, self-packaged uncooled microbolometer on a flexible substrate towards an infrared radiation sensitive skin
Author :
Ahmed, Moinuddin ; Butler, Donald P. ; Celik-Butler, Zeynep
Author_Institution :
Dept. of Electr. Eng., Univ. of Texas at Arlington, Arlington, TX, USA
fYear :
2014
fDate :
2-5 Nov. 2014
Firstpage :
2155
Lastpage :
2158
Abstract :
This paper describes fabrication and characterization of self-packaged microbolometers on a flexible substrate. Amorphous silicon (a-Si) was used as the sensing material and the entire detector was device-level packaged in a vacuum cavity with an aluminum oxide packaging layer which can withstand up to 10 atm pressure. The flicker noise coefficient K1/f was calculated to be 1.23 ×10-13 for the a-Si detecting material from the measured noise spectra.
Keywords :
amorphous semiconductors; bolometers; electronics packaging; flicker noise; infrared detectors; microsensors; silicon; skin; Si; device level packaging; flexible substrate; flicker noise coefficient; infrared detector; infrared radiation sensitive skin; self-packaged uncooled microbolometer; vacuum cavity; Bolometers; Choppers (circuits); Detectors; Noise; Polyimides; Resistors; Substrates; device-level-packaged; flexible substrate; uncooled infrared detector;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SENSORS, 2014 IEEE
Conference_Location :
Valencia
Type :
conf
DOI :
10.1109/ICSENS.2014.6985465
Filename :
6985465
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=190321
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