DocumentCode
1903342
Title
Ultrashallow Emitter-Base Profiles by Double Diffusion
Author
Biebl, M. ; Bianco, M. ; Ehinger, K. ; Philipsborn, H.v. ; Klose, H.
Author_Institution
Siemens AG, Corporate Research, Otto-Hahn-Ring 6, 8000 Munich 83, FRG; Universitÿt Regensburg, NWF II, Physik, Universitÿtsstr. 31, 8400 Regensburg, FRG
fYear
1992
fDate
14-17 Sept. 1992
Firstpage
347
Lastpage
350
Abstract
The diffusion of boron out of polysilicon was investigated. Diffusion and segregation coefficients were determined for furnace annealing and rapid thermal processing. Double polysilicon self-aligned npn bipolar transistors with sub 100 nm base widths were obtained, using the double diffusion technique. Calculations for the optimization of the base pinch resistance are presented. It is shown that base widths as low as 50 nm can be obtained with the double diffusion technique.
Keywords
Bipolar transistors; Boron; Electrical resistance measurement; Furnaces; Ion implantation; Microelectronics; Rapid thermal annealing; Rapid thermal processing; Silicon; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European
Conference_Location
Leuven, Belgium
Print_ISBN
0444894780
Type
conf
Filename
5435115
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