DocumentCode
1903937
Title
In-line automatic defect classification [wafer fabrication]
Author
Bennett, Marylyn Hoy ; Garvin, James F. ; Hightower, Jesse B. ; Coldren, David ; Reddy, Mahesh
Author_Institution
Manuf. Sci. & Technol., Texas Instrum. Inc., Dallas, TX, USA
fYear
1997
fDate
6-8 Oct 1997
Abstract
Manual review of wafers and classification of defects is a slow, tedious process. While identification of defects is important, this step in wafer fabrication can be a bottleneck to throughput. The accuracy of human classification can vary from day to day, and person to person. In-Line Automatic Defect Classification (ADC) is an emerging technology aimed at solving this problem
Keywords
automatic optical inspection; electronic engineering computing; image classification; integrated circuit manufacture; production engineering computing; AOI; IC manufacture; in-line automatic defect classification; wafer fabrication; Cameras; Failure analysis; Focusing; Inspection; Instruments; Manufacturing; Optical imaging; Production; Testing; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-3752-2
Type
conf
DOI
10.1109/ISSM.1997.664582
Filename
664582
Link To Document