DocumentCode :
1903979
Title :
Improvement of data retention time in DRAM using recessed channel array transistors with asymmetric channel doping for 80 nm feature size and beyond
Author :
Lee, J.W. ; Kim, Y.S. ; Kim, J.-Y. ; Park, Y.K. ; Shin, S.H. ; Lee, S.-H. ; Oh, J.H. ; Lee, J.G. ; Lee, J.Y. ; Bae, D.I. ; Lee, E.-C. ; Lee, C.S. ; Yun, C.J. ; Cho, C.H. ; Jin, K.Y. ; Park, Y.J. ; Chung, T.Y. ; Kinam Kim
Author_Institution :
Semicond. R&D Center, Samsung Electron. Co. Ltd., Kyunggi-Do, South Korea
fYear :
2004
fDate :
21-23 Sept. 2004
Firstpage :
449
Lastpage :
452
Abstract :
A 512 Mb DRAM using a recessed channel array transistor with asymmetric channel doping scheme (RCAT-ASC) is fabricated for the first time with 80 nm feature size. We have found that RCAT-ASC shows much better device performance than the normal RCAT-SC (recessed channel array transistor with symmetric channel doping scheme) or PCAT-ASC (planar channel array transistor with asymmetric channel doping scheme). The RCAT-ASC has the lowest junction leakage currents at storage nodes among them. The increase of data retention time is found to be very remarkable, and thus we suggest that the RCAT-ASC should be an effective method for longer data retention time of DRAM for the future generations. Additionally, we also found that the charge sharing time (tCS) of RCAT-ASC has the lowest values among the three array transistor schemes.
Keywords :
DRAM chips; doping profiles; leakage currents; 512 Mbit; 80 nm; DRAM; RCAT-ASC; asymmetric channel doping; charge sharing time; data retention time increase; recessed channel array transistors; storage node junction leakage currents; Computer aided engineering; Degradation; Fabrication; Ion implantation; Leakage current; Random access memory; Research and development; Semiconductor device doping; Tin; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research conference, 2004. ESSDERC 2004. Proceeding of the 34th European
Print_ISBN :
0-7803-8478-4
Type :
conf
DOI :
10.1109/ESSDER.2004.1356588
Filename :
1356588
Link To Document :
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