Title :
A dual Sticking Coefficient Chemical Vapor Deposition Model
Author :
Wille, Holger ; Burte, Edmund P.
Author_Institution :
Fraunhofer Arbeitsgruppe fÿr Integrierte Schaltungen, Artilleriestrasse 12, 8520 Erlangen, Germany
Abstract :
A quantitatively exact simulation of the step coverage of thin solid films prepared by low pressure chemical vapor deposition (LPCVD) is helpful to the computer aided development of the fabrication process of microelectronic devices. In addition, conclusions regarding the molecular microscopic reactions can be drawn due to our most simple physico-chemical model with only three well comprehensible parameters.
Keywords :
Chemical vapor deposition; Computational modeling; Computer simulation; Differential equations; Fabrication; Microelectronics; Solid modeling; Substrates; Surface topography; Temperature;
Conference_Titel :
Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European
Conference_Location :
Leuven, Belgium
