• DocumentCode
    1904405
  • Title

    Short links modelling in multi-level package

  • Author

    Hassaïne, N. ; Mezui-Mintsa, R. ; Boudiaf, A. ; Konczykowska, A. ; Wang, H.

  • Author_Institution
    France Telecom, Centre National d´´Etudes des Télécommunications, Laboratoire de Bagneux, 196, Avenue Henri Ravera, 92220 Bagneux, FRANCE. Fax: (33) 1 47 46 04 17
  • fYear
    1992
  • fDate
    14-17 Sept. 1992
  • Firstpage
    567
  • Lastpage
    570
  • Abstract
    A general approach for computing the inductance coefficients of short links (gold wire connections and vias) is given. The |L| matrix calculation is performed with the potential vector given in its integral form, taking into account the current density distribution (J) in the conductor. The partial element equivalent circuit method (PEEC) [1], [2] is used for this calculation. Analytical formulas easily used in CAD are derived from the numerical results using a least square fit. The simulation is compared with experimental results showing a very good agreement.
  • Keywords
    Bonding; Conductors; Current density; Electromagnetic analysis; Equivalent circuits; Gold; Inductance; Integrated circuit interconnections; Packaging; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European
  • Conference_Location
    Leuven, Belgium
  • Print_ISBN
    0444894780
  • Type

    conf

  • Filename
    5435162
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1904405