DocumentCode :
1904430
Title :
Thermodynamic analysis of copper CVD using CuCI as precursor
Author :
Madar, R. ; Bernard, C. ; Palleau, J. ; Torres, J.
Author_Institution :
LMGP - ENSPG - BP 46, 38402 Saint Martin d´´Hÿres - France
fYear :
1992
fDate :
14-17 Sept. 1992
Firstpage :
571
Lastpage :
574
Keywords :
Argon; Conducting materials; Copper; Dielectric materials; Dielectric substrates; Dielectric thin films; Polymer films; Sputtering; Temperature; Thermodynamics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European
Conference_Location :
Leuven, Belgium
Print_ISBN :
0444894780
Type :
conf
Filename :
5435163
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1904430
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