Title :
Ta/polyimide adhesion durability
Author :
Callegari, A. ; Furman, B. ; Graham, T. ; Clearfield, I.L. ; Price, William ; Purushothaman, S.
Author_Institution :
IBM T.J. Watson Research center, P.O. Box 218, Yorktown Heights, NY 10598
Abstract :
The adhesion durability of Ta to plasma-modified polyimide surfaces has been investigated under thermal exposure. The failure mechanism was correlated with Auger analysis. Resistance to oxidation at the Ta/polyimide interface was found necessary to obtain a durable metal/polymer adhesion strength.
Keywords :
Adhesives; Argon; Chemical analysis; Failure analysis; Plasmas; Polyimides; Surface emitting lasers; Thermal engineering; Thermal resistance; Thermal stresses;
Conference_Titel :
Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European
Conference_Location :
Leuven, Belgium
