DocumentCode
1904855
Title
Mateability of tin to gold, palladium, and silver
Author
Bock, Edward
Author_Institution
AMP Inc., Harrisburg, PA, USA
fYear
1990
fDate
20-23 May 1990
Firstpage
840
Abstract
It is shown experimentally that tin in combination with itself, as well as with gold, palladium, or silver is susceptible to fretting corrosion. Rates of degradation depend upon the metals in contact and upon the state and type of lubrication. In both the clean and lubricated state, the degradation of tin-to-gold and tin-to-palladium would be considered worse than tin-to-tin. The performance of tin-to-silver is slightly better than tin-to-tin. Antifretting contact lubricant formulations are preferred to antiwear contact lubricants. A proprietary formulation is shown to be very effective in stabilizing contact resistance for the tin-to-tin and tin-to-silver combinations. However, increases in contact resistance (on the order of five times the initial values) for the tin-to-gold and tin-to-palladium interfaces demonstrate that such combinations should not be encouraged for critical circuit applications in environments where fretting reactions are likely
Keywords
contact resistance; corrosion; corrosion protection; gold; interface phenomena; lubrication; palladium; silver; tin; Sn-Ag; Sn-Au; Sn-Pd; antifretting contact lubricant formulations; contact resistance; critical circuit applications; degradation rate; electrical connectors; fretting corrosion; lubrication; mateability; metals; Circuits; Contact resistance; Corrosion; Degradation; Gold; Lubricants; Lubrication; Palladium; Silver; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ECTC.1990.122287
Filename
122287
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