Title :
Benchmarking of Metal-to-Carbon Nanotube Side Contact Resistance
Author :
Liu, Zhengchun ; Ci, Lijie ; Bajwa, Navdeep ; Ajayan, Pulickel M. ; Lu, Jian-Qiang
Author_Institution :
Center for Integrated Electronics, Rensselaer Polytechnic Institute, 110 Eighth Street, Troy, NY 12180
Abstract :
We report on side-contact resistances of four promising metal/multiwall-carbon-nanotube contacts utilizing transfer length method (TLM) test structures on densified carbon nanotube (CNT) strips formed from vertically-aligned CNT forests. Contact resistances of Ti/CNT, Pd/CNT, Ta/CNT, and W/CNT contacts with the same nominal contact area were extracted to be 40, 49, 108, and 160 ¿, respectively. Rapid thermal annealing at 400 °C for 5 min reduces the Ta/CNT and W/CNT contact resistances while increasing the Ti/CNT and Pd/CNT ones.
Keywords :
Carbon nanotubes; Contact resistance; Electronic equipment testing; Integrated circuit interconnections; Iron; Organic materials; Rapid thermal annealing; Strips; Surface treatment; Thermal resistance;
Conference_Titel :
Interconnect Technology Conference, 2008. IITC 2008. International
Conference_Location :
Burlingame, CA, USA
Print_ISBN :
978-1-4244-1911-1
Electronic_ISBN :
978-1-4244-1912-8
DOI :
10.1109/IITC.2008.4546950
