DocumentCode :
1905234
Title :
An Experimental Study on Contact Resistance Characteristics of Relay Contacts Operated in the Vicinity of New Telechelic Polyacrylate Polymers
Author :
Hasegawa, Makoto ; Kobayashi, Nanae ; Kohno, Yoshiyuki ; Ando, Hiroshi
Author_Institution :
Chitose Inst. of Sci. & Technol., Chitose, Japan
fYear :
2012
fDate :
23-26 Sept. 2012
Firstpage :
1
Lastpage :
5
Abstract :
When relays were operated to break load currents in vapors evaporated from a new telechelic polyacrylate polymer that is an acryl-based non-silicone-type polymer and can be used as replacement of conventional silicone-type products, resultant contact resistance characteristics show no deterioration. In this paper, for the purpose of investigating influences of differences in curing processes, the several telechelic polyacrylate polymers of UV-radiation-cured type were used, and influences of their vapors on contact resistance characteristics of mechanical relays at an ambient temperature of 120°C were studied. More specifically, a commercially-available mechanical relay (AgSnIn contacts) was sealed into a metal can with one of the cured telechelic polyacrylate polymers, and placed in a heating chamber to operate 40,000 break operations of an inductive DC 14V-1A or 14V-0.4A load current at an operating frequency of 1 Hz or 0.5 Hz. As a result, the relays showed no deterioration in contact resistances. Thus, it was confirmed that vapors from these UV-radiation-cured type telechelic polyacrylate polymers cause no adverse effects on contact resistance characteristics.
Keywords :
contact resistance; electrical contacts; polymers; relays; UV-radiation-cured type; acryl-based nonsilicone-type polymer; contact resistance; current 0.4 A; current 1 A; frequency 0.5 Hz; frequency 1 Hz; mechanical relays; relay contacts; telechelic polyacrylate polymers; temperature 120 C; voltage 14 V; Contact resistance; Curing; Metals; Plastics; Relays; Surface resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Contacts (Holm), 2012 IEEE 58th Holm Conference on
Conference_Location :
Portland, OR
ISSN :
1062-6808
Print_ISBN :
978-1-4673-0778-9
Type :
conf
DOI :
10.1109/HOLM.2012.6336570
Filename :
6336570
Link To Document :
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