Title :
Impact of LER and misaligned vias on the electric field in nanometer-scale wires
Author :
Stucchi, Michele ; Tokei, Zsolt
Author_Institution :
IMEC, Kapeldreef 75, B-3001, Leuven, Belgium, Tel.: +32-16-281681; Fax: +32-16-281576; e-mail: stucchi@imec.be
Abstract :
Electric field enhancement due to LER and misaligned vias is analyzed, modeled and quantified in nanometer-scale wires. For LER, the statistical and wirelength-dependent impact of field enhancement on dielectric breakdown is analyzed and compared with experimental results on wire test structures.
Keywords :
Dielectric breakdown; Electric resistance; Electronic mail; Etching; Lithography; Predictive models; Probability; Testing; Voltage; Wires;
Conference_Titel :
Interconnect Technology Conference, 2008. IITC 2008. International
Conference_Location :
Burlingame, CA, USA
Print_ISBN :
978-1-4244-1911-1
Electronic_ISBN :
978-1-4244-1912-8
DOI :
10.1109/IITC.2008.4546959
