DocumentCode
1905560
Title
The impact of random doping effects on CMOS SRAM cell
Author
Cheng, B. ; Roy, S. ; Asenov, A.
Author_Institution
Dept. of Electron. & Electr. Eng., Glasgow Univ., UK
fYear
2004
fDate
21-23 Sept. 2004
Firstpage
219
Lastpage
222
Abstract
The SRAM has a very constrained cell area and is consequently sensitive to the intrinsic parameter fluctuations ubiquitous in decananometer scale MOSFETs. Using a statistical circuit simulation methodology, which can fully collate intrinsic parameter fluctuation information into compact model sets, the impact of random device doping on 6-T SRAM static noise margins, and read and write characteristics are investigated in detail for well-scaled 35 nm physical gate length devices. We conclude that intrinsic parameter fluctuations will become a major limitation to further conventional MOSFET SRAM scaling.
Keywords
CMOS memory circuits; SRAM chips; circuit simulation; doping profiles; integrated circuit modelling; integrated circuit noise; 35 nm; CMOS SRAM cell; MOSFET scaling limitations; cell area constraints; intrinsic parameter fluctuations; random doping effects; read/write characteristics; static noise margins; statistical circuit simulation; Circuit simulation; Doping; Fluctuations; MOSFET circuits; Modems; Random access memory; Semiconductor device modeling; Semiconductor process modeling; System-on-a-chip; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2004. ESSCIRC 2004. Proceeding of the 30th European
Print_ISBN
0-7803-8480-6
Type
conf
DOI
10.1109/ESSCIR.2004.1356657
Filename
1356657
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