DocumentCode
1905699
Title
Sub-ns Delay Through Multi-Wall Carbon Nanotube Local Interconnects in a CMOS Integrated Circuit
Author
Close, Gael F. ; Yasuda, Shinichi ; Paul, Bipul ; Fujita, Shinobu ; Wong, H. S Philip
Author_Institution
Center for Integrated Systems and Department of Electrical Engineering, Stanford University, Stanford CA, USA., Email: closega@stanford.edu
fYear
2008
fDate
1-4 June 2008
Firstpage
234
Lastpage
236
Abstract
A CMOS integrated circuit with multi-wall carbon nanotube (MWCNT) interconnects is presented, and its speed is analyzed. This chip is a platform to evaluate the merits of MWCNT interconnects in a silicon integrated circuit environment. Using this platform, we evaluate local interconnects (14¿m long) made of a single 30nm-diameter MWCNT. We experimentally extract the sub-ns delay of these wires to benchmark their future potential for the first time. Furthermore, we compare our experimental results with an existing MWCNT interconnect model, and discuss the origin of discrepancies.
Keywords
Assembly; CMOS integrated circuits; CMOS technology; Carbon nanotubes; Conductivity; Copper; Delay; Electrical resistance measurement; Integrated circuit interconnections; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2008. IITC 2008. International
Conference_Location
Burlingame, CA, USA
Print_ISBN
978-1-4244-1911-1
Electronic_ISBN
978-1-4244-1912-8
Type
conf
DOI
10.1109/IITC.2008.4546976
Filename
4546976
Link To Document