• DocumentCode
    1905699
  • Title

    Sub-ns Delay Through Multi-Wall Carbon Nanotube Local Interconnects in a CMOS Integrated Circuit

  • Author

    Close, Gael F. ; Yasuda, Shinichi ; Paul, Bipul ; Fujita, Shinobu ; Wong, H. S Philip

  • Author_Institution
    Center for Integrated Systems and Department of Electrical Engineering, Stanford University, Stanford CA, USA., Email: closega@stanford.edu
  • fYear
    2008
  • fDate
    1-4 June 2008
  • Firstpage
    234
  • Lastpage
    236
  • Abstract
    A CMOS integrated circuit with multi-wall carbon nanotube (MWCNT) interconnects is presented, and its speed is analyzed. This chip is a platform to evaluate the merits of MWCNT interconnects in a silicon integrated circuit environment. Using this platform, we evaluate local interconnects (14¿m long) made of a single 30nm-diameter MWCNT. We experimentally extract the sub-ns delay of these wires to benchmark their future potential for the first time. Furthermore, we compare our experimental results with an existing MWCNT interconnect model, and discuss the origin of discrepancies.
  • Keywords
    Assembly; CMOS integrated circuits; CMOS technology; Carbon nanotubes; Conductivity; Copper; Delay; Electrical resistance measurement; Integrated circuit interconnections; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 2008. IITC 2008. International
  • Conference_Location
    Burlingame, CA, USA
  • Print_ISBN
    978-1-4244-1911-1
  • Electronic_ISBN
    978-1-4244-1912-8
  • Type

    conf

  • DOI
    10.1109/IITC.2008.4546976
  • Filename
    4546976