DocumentCode :
1906008
Title :
A Study of Contact Endurance Switching Life as a Function of Contact Bond Quality, Contact Electrical Load and Residual Stresses for Silver Tin Indium Oxide Composite Rivet Contacts
Author :
Chen, Z.K. ; Witter, G.J.
Author_Institution :
Chugai USA LLC, Waukegan, IL, USA
fYear :
2012
fDate :
23-26 Sept. 2012
Firstpage :
1
Lastpage :
7
Abstract :
This work investigates contact endurance switching life as a function of the contact interface bond quality and residual stresses created in the contacts by different electrical loads. Comparisons are made using resistive loads under different DC voltages and currents and also some AC loads. The mechanisms for failure for different levels of power loads and bond quality are explained in terms of thermal and mechanical stress levels and arc energy. This work covers machine made composite rivets with silver tin indium oxide material directly bonded to ETP copper. It also shows how liquid metal embrittlement of the contact can result from long duration switching endurance.
Keywords :
bonding processes; electrical contacts; failure (mechanical); failure analysis; liquid metal embrittlement; load (electric); quality control; remaining life assessment; riveting; silver compounds; thermal stresses; tin compounds; AC loads; AgSnInO; DC currents; DC voltages; ETP copper; contact electrical load; contact endurance switching life; contact interface bond quality; electrical loads; failure mechanisms; liquid metal embrittlement; long duration switching endurance; mechanical stress level; power loads; residual stresses; resistive loads; silver tin indium oxide composite rivet contacts; thermal stress level; Contacts; Copper; Relays; Silver; Springs; Stress; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Contacts (Holm), 2012 IEEE 58th Holm Conference on
Conference_Location :
Portland, OR
ISSN :
1062-6808
Print_ISBN :
978-1-4673-0778-9
Type :
conf
DOI :
10.1109/HOLM.2012.6336601
Filename :
6336601
Link To Document :
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