DocumentCode
1906027
Title
Effect of Ambient Temperature and Contact Force on Contact Resistance and Overtemperature Behaviour for Power Engineering Contacts
Author
Behrens, Volker ; Siegle, Edgar ; Schreiber, Jonas ; Honig, Thomas ; Finkbeiner, Michael
Author_Institution
Doduco GmbH, Pforzheim, Germany
fYear
2012
fDate
23-26 Sept. 2012
Firstpage
1
Lastpage
6
Abstract
With switching devices for power engineering applications the question of overtemperature at steady state current becomes more important as the size of said devices decreases and/or rated currents increase. In order to evaluate the influence of parameters as contact material, contact force, ambient temperature, current and current flow time a PC driven model switch is build up with the ability to set these parameters easily. This paper describes the setup of the model switch and gives first results of tests related to typical conditions of MCCB with a rated current of 160 A. Parameter variations include contact force (5N to 30 N), ambient temperature (25°C to 125°C) and contact material (Ag/C, Ag/Ni, Ag/W, AgNi0,15). Results obtained are discussed on the background of contact surface roughness as well as contact material properties as electrical conductivity and hardness as a function of temperature.
Keywords
contact resistance; electrical conductivity; power engineering; MCCB; PC driven model switch; ambient temperature effect; contact force effect; contact resistance; current 160 A; current flow time; electrical conductivity; overtemperature; parameter variations; power engineering contact; steady state current; switching devices; Contact resistance; Force; Materials; Nickel; Switches; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts (Holm), 2012 IEEE 58th Holm Conference on
Conference_Location
Portland, OR
ISSN
1062-6808
Print_ISBN
978-1-4673-0778-9
Type
conf
DOI
10.1109/HOLM.2012.6336603
Filename
6336603
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